Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10160066 | Methods and systems for reinforced adhesive bonding using solder elements and flux | Blair E. Carlson, Yongbing Li | 2018-12-25 |
| 9950319 | High exchange-capacity anion exchange resin with dual functional-groups and method of synthesis thereof | Jinnan Wang, Yi Wang, Cheng-Yi Cheng, Chen Chen | 2018-04-24 |