Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043764 | Through silicon via device having low stress, thin film gaps and methods for forming the same | Huang Liu, Chun Yu Wong | 2018-08-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043764 | Through silicon via device having low stress, thin film gaps and methods for forming the same | Huang Liu, Chun Yu Wong | 2018-08-07 |