Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991202 | Method to reduce resistance for a copper (CU) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom | Jim Shih-Chun Liang, Atsushi Ogino | 2018-06-05 |