Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10014279 | Methods of forming 3-D integrated semiconductor devices having intermediate heat spreading capabilities | Thomas Werner, Michael Grillberger | 2018-07-03 |
FF
Frank Feustel
Overall (2018): #419,113 of 503,207Top 85%
1
Patents 2018