Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157833 | Via and skip via structures | Xunyuan Zhang, Frank W. Mont | 2018-12-18 |
| 10090150 | Low dielectric constant (low-k) dielectric and method of forming the same | J. Leon Shohet, Huifeng Zheng, Xiangyu Guo, Weiyi Li, Joshua M. Blatz | 2018-10-02 |