Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9859236 | Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same | Meng Meng Chong, Chim Seng Seet, Xiaohua Zhan | 2018-01-02 |