Issued Patents 2018
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147660 | Remapped packaged extracted die with 3D printed bond connections | — | 2018-12-04 |
| 10128161 | 3D printed hermetic package assembly and method | — | 2018-11-13 |
| 10115645 | Repackaged reconditioned die method and assembly | — | 2018-10-30 |
| 10109606 | Remapped packaged extracted die | — | 2018-10-23 |
| 10002846 | Method for remapping a packaged extracted die with 3D printed bond connections | — | 2018-06-19 |
| 9966319 | Environmental hardening integrated circuit method and apparatus | — | 2018-05-08 |
| 9935028 | Method and apparatus for printing integrated circuit bond connections | — | 2018-04-03 |
| 9870968 | Repackaged integrated circuit and assembly method | Timothy Mark Barry | 2018-01-16 |