Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10137518 | Semiconductor package, electronic device, and solder mounting method | — | 2018-11-27 |
| 10093831 | Copolymerized polysilazane, manufacturing method therefor, composition comprising same, and method for forming siliceous film using same | Jun Yamakawa, Takashi Fujiwara, Hiroyuki Aoki | 2018-10-09 |