Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128345 | Semiconductor device | Hiromichi Gohara, Takafumi Yamada, Kohei Yamauchi, Tatsuhiko Asai, Yoshitaka Nishimura +3 more | 2018-11-13 |
| 9871006 | Semiconductor module having a solder-bonded cooling unit | Takafumi Yamada, Hiromichi Gohara | 2018-01-16 |