Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10118255 | Cutting method of a multilayer structure containing a brittle layer | Jyun-Kai Ciou, Yung-Min Hsieh, Naotoshi Inayama, Takehiko ISOMOTO, Takahide Fujii +1 more | 2018-11-06 |
| 10100410 | Film thickness monitoring system and method using the same | Yu-Lin Hsu, Chien-Hung Lin, Pang-Min Shih, Chao-Feng Sung | 2018-10-16 |
| 10096745 | Light emitting diode capable of generating different light colors over single wafer | Chun-Der Wu, Tzeng-Guang Tsai, Kuo-Shu Tseng | 2018-10-09 |
| 9902564 | Roller assembly, step roller thereof, and method for transporting substrate using the same | Chao-Feng Sung, Yu-Lin Hsu, Hsin-Yun Hsu, I-Chung Kao, Kuo-Jung Sun +2 more | 2018-02-27 |