Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9887465 | Single-layer metalization and via-less metamaterial structures | Ajay Gummalla, Maha Achour, Cheng-Jung Lee, Vaneet Pathak | 2018-02-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9887465 | Single-layer metalization and via-less metamaterial structures | Ajay Gummalla, Maha Achour, Cheng-Jung Lee, Vaneet Pathak | 2018-02-06 |