Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10072148 | Resin composition, copper clad laminate and printed circuit board using same | Rongtao WANG, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng Lv | 2018-09-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10072148 | Resin composition, copper clad laminate and printed circuit board using same | Rongtao WANG, Yu-Te Lin, Wenjun Tian, Ziqian Ma, Wenfeng Lv | 2018-09-11 |