HO

Hideyo Osanai

DC Dowa Metaltech Co.: 1 patents #5 of 15Top 35%
TO Tokuyama: 1 patents #4 of 19Top 25%
Overall (2018): #397,316 of 503,207Top 80%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9944565 Metal/ceramic bonding substrate and method for producing same Yukihiro Kitamura, Hiroto Aoki, Yukihiro Kanechika, Ken Sugawara, Yasuko Takeda 2018-04-17