Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090275 | Bonding method using bonding material | Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata | 2018-10-02 |
| 10062473 | Silver-coated copper alloy powder and method for producing same | Kenichi Inoue, Kozo Ogi, Atsushi Ebara, Yuto Hiyama, Takahiro Yamada | 2018-08-28 |
| 10008471 | Bonding material and bonding method using the same | Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Hirata | 2018-06-26 |