Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9957389 | Thermosetting resin composition having heat resistance and low dielectric loss characteristics, prepreg using same, and copper clad laminate | Dong Hee JUNG, Jeong Don Kwon, Moo-Hyun Kim, Do Woong Hong | 2018-05-01 |