Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9884452 | Substrate-bonding device and method of the same | Lin Wang, Lai-Peng Lai, Ying Chen | 2018-02-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9884452 | Substrate-bonding device and method of the same | Lin Wang, Lai-Peng Lai, Ying Chen | 2018-02-06 |