Issued Patents 2018
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10155323 | SiC wafer producing method | — | 2018-12-18 |
| 10112256 | SiC wafer producing method | — | 2018-10-30 |
| 10105792 | SiC substrate separating method | — | 2018-10-23 |
| 10094047 | Wafer producing method | — | 2018-10-09 |
| 10081076 | Wafer producing method | Yoko Nishino, Tomoki Yoshino | 2018-09-25 |
| 10076804 | Wafer producing method | Yoko Nishino, Kunimitsu Takahashi | 2018-09-18 |
| 10071442 | Laser processing apparatus | Hiroshi Morikazu, Noboru Takeda | 2018-09-11 |
| 10029383 | Wafer producing method | — | 2018-07-24 |
| 9981339 | Wafer producing method | — | 2018-05-29 |
| 9975202 | Method of producing SiC wafer | Ryohei Yamamoto | 2018-05-22 |
| 9941130 | Thin plate separating method | — | 2018-04-10 |
| 9925619 | Wafer producing method | Kunimitsu Takahashi, Yoko Nishino | 2018-03-27 |
| 9899262 | Wafer processing method | Yoko Nishino | 2018-02-20 |
| 9884389 | SiC ingot slicing method | Yoko Nishino | 2018-02-06 |
| 9884390 | Wafer producing method | Kunimitsu Takahashi, Yoko Nishino | 2018-02-06 |
| 9878397 | SiC wafer producing method | Yukio Morishige | 2018-01-30 |
| 9868177 | Wafer producing method | — | 2018-01-16 |