Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10040204 | Plate-shaped workpiece transfer apparatus and processing apparatus | — | 2018-08-07 |
| 9934957 | Method of processing bonded wafer | Hirohiko Kozai, Meiyu Piao | 2018-04-03 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10040204 | Plate-shaped workpiece transfer apparatus and processing apparatus | — | 2018-08-07 |
| 9934957 | Method of processing bonded wafer | Hirohiko Kozai, Meiyu Piao | 2018-04-03 |