Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10113028 | Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded article | Yousuke Hirota, Takamitsu Nakamura | 2018-10-30 |
| 10081585 | Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2018-09-25 |
| 10011676 | Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2018-07-03 |
| 9902798 | Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi, Gensuke Akimoto | 2018-02-27 |
| 9890237 | Epoxy compound, epoxy resin, curable compound, cured product thereof, semiconductor sealing material, and printed circuit board | Ayumi Takahashi | 2018-02-13 |