RS

Rajwant Sidhu

VL Viasystems Technologies Corp. L.L.C.: 1 patents #1 of 2Top 50%
📍 Brea, CA: #15 of 39 inventorsTop 40%
🗺 California: #23,431 of 60,411 inventorsTop 40%
Overall (2018): #268,175 of 503,207Top 55%
1
Patents 2018

Issued Patents 2018

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9913382 Method for anchoring a conductive cap on a filled via in a printed circuit board and printed circuit board with an anchored conductive cap Ruben Zepeda 2018-03-06