Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10020244 | Polymer via plugs with high thermal integrity | Helmut Hagleitner, William T. Pulz | 2018-07-10 |
| 9998109 | Power module with improved reliability | Mrinal K. Das, Adam Barkley, Brian Fetzer, Jonathan D. Young, Scott Allen | 2018-06-12 |
| 9991399 | Passivation structure for semiconductor devices | Jonathan D. Young, Qingchun Zhang, John Williams Palmour | 2018-06-05 |