Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10156352 | In mold electronic printed circuit board encapsulation and assembly | David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James M. Lorenzo +2 more | 2018-12-18 |