Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9865545 | Plurality of substrates bonded by direct bonding of copper recesses | Viorel Balan | 2018-01-09 |
MR
Maurice Rivoire
Stmicroelectronics (Crolles 2) Sas: 1 patents #29 of 106Top 30%
Overall (2018): #313,641 of 503,207Top 65%
1
Patents 2018