| 1 |
Aaron A. Yarbrough |
GE |
17 |
| 2 |
Clinton C. Thackery |
Tti (Macao Commercial Offshore) Limited |
3 |
| 2 |
Xiaofei Jiang |
Pacesetter |
3 |
| #4 |
Timothy Willis |
Electrolux Home Products |
2 |
| #4 |
Rhett Smith |
Schweitzer Engineering Laboratories |
2 |
| #4 |
Zhuochen Shi |
Electrolux Home Products |
2 |
| #4 |
Judson D. Ryckman |
Intel |
2 |
| #4 |
Michael K. Gallagher |
Rohm And Haas Electronic Materials |
2 |
| #4 |
Bogdan Zdyrko |
Sila Nanotechnologies |
2 |
| #4 |
Eric Montgomery Lucas |
Apple |
2 |
| #4 |
Thomas Kurfess |
Georgia Tech Research |
2 |
| #12 |
Mark A. Blenner |
Columbia University |
1 |
| #12 |
Russell Buchanan |
Clemson University |
1 |
| #12 |
Alison Martin |
Clemson University |
1 |
| #12 |
Nihar Ranjan |
Clemson University |
1 |
| #12 |
Dustin Graham Albright |
Clemson University |
1 |
| #12 |
Jeoung Soo Lee |
Adhezion Biomedical |
1 |
| #12 |
Richard Epley |
GE |
1 |
| #12 |
Dmytro Konobrytskyi |
Mitsubishi Electric |
1 |
| #12 |
Andrew C. Warner |
Clemson University |
1 |
| #12 |
Daniel Nevin Harding |
Clemson University |
1 |
| #12 |
Charles Kenneth Webb |
Adhezion Biomedical |
1 |
| #12 |
March Maguire |
Hoowaki |
1 |
| #12 |
Marek W. Urban |
University Of Southern Mississippi |
1 |
| #12 |
Mark C. Thies |
Clemson University |
1 |
| #12 |
Christopher S. Tennant |
Power Tool Institute |
1 |
| #12 |
Brandon DelSpina |
— |
1 |
| #12 |
Jon Pennington |
Clemson University |
1 |
| #12 |
Tyler Silvers |
Clemson University |
1 |
| #12 |
Allyson Beck |
Clemson University |
1 |
| #12 |
Jacob Sorber |
Dartmouth College |
1 |
| #12 |
Brian Albert Williams |
Tti (Macao Commercial Offshore) Limited |
1 |
| #12 |
Carrie Lirae Merck |
Ansell Limited |
1 |