Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10090780 | Device with electrode connected to through wire, and method for manufacturing the same | Shinan Wang | 2018-10-02 |
| 9953734 | Microstructure manufacturing method | Shinan Wang, Takashi Nakamura, Takayuki Teshima, Shinichiro Watanabe | 2018-04-24 |
| 9927349 | Method of producing through wiring substrate and method of producing device | Shinan Wang | 2018-03-27 |
| 9891327 | Structure, method for manufacturing the same, and image pickup apparatus including the structure | Takayuki Teshima | 2018-02-13 |