Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10016859 | Manufacturing method of thermal module assembling structure | Kuo-Sheng Lin | 2018-07-10 |
| 9905495 | Thermal module | — | 2018-02-27 |
| 9895778 | Heat dissipation unit manufacturing method | — | 2018-02-20 |