Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9896546 | Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same | Koichiro Shimoda, Yasuhito Iizuka, Masaki Yamamoto, Yoro Sasaki, Hiroaki Adachi | 2018-02-20 |