Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10098221 | Heat transfer assembly providing heat transfer from a module mounted on a circuit board through the circuit board | Rafael CELEDON, Michael G. Jones | 2018-10-09 | $7,547,000 |