Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9870988 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Martin Schrems, Franz Schrank | 2018-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9870988 | Method of producing a semiconductor device with through-substrate via covered by a solder ball | Martin Schrems, Franz Schrank | 2018-01-16 |