Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9880966 | Encapsulating metadata of a platform for application-specific tailoring and reuse of the platform in an integrated circuit | L. James Hwang, Sundararajarao Mohan, Jorge Ernesto Carrillo, Hua Sun | 2018-01-30 |