Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134607 | Method for low temperature bonding of wafers | Vivek Chidambaram, Sunil Wickramanayaka, Zhipeng DING, Li Yan SIOW | 2018-11-20 |
| 10076772 | Transducer and method for forming the same | Hongbin Yu, Liang LOU, Alex Gu | 2018-09-18 |