Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103107 | Semiconductor device and method for manufacturing the same | — | 2018-10-16 |
| 10068851 | Semiconductor package structure and method for manufacturing the same | — | 2018-09-04 |
| 10002849 | Semiconductor package structure and method for manufacturing the same | — | 2018-06-19 |
| 9947635 | Semiconductor package, interposer and semiconductor process for manufacturing the same | Yuan-Feng Chiang, Chi-Chang Lee, Chung-Hsi Wu | 2018-04-17 |
| 9929078 | Semiconductor package structure and method for manufacturing the same | Chi-Chang Lee, Wei-Min Hsiao, Yuan-Feng Chiang | 2018-03-27 |