Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10069051 | Semiconductor package device and method of manufacturing the same | Hsun-Wei Chan, Lu-Ming Lai | 2018-09-04 |
| 9911877 | Electronic device, package structure and method of manufacturing the same | Chia-Yun Hsu, Tsung-Yu Lin | 2018-03-06 |
| 9862799 | Polymer particle and preparation method thereof | Hsien-Yeh Chen, Ho-Yi Sun, Cheng-Yuan Fang | 2018-01-09 |