Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074622 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao, Fu-Chen Chu | 2018-09-11 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10074622 | Semiconductor package device and method of manufacturing the same | Chang-Lin Yeh, Jen-Chieh Kao, Fu-Chen Chu | 2018-09-11 |