Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157821 | Semiconductor packages | — | 2018-12-18 |
| 10056313 | Power module of square flat pin-free packaging structure | Siyang Liu, Ning WANG, Jiaxing Wei, Weifeng Sun, Shengli Lu +1 more | 2018-08-21 |