Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9955590 | Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same | — | 2018-04-24 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9955590 | Redistribution layer structure, semiconductor substrate structure, semiconductor package structure, chip structure, and method of manufacturing the same | — | 2018-04-24 |