Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10134677 | Semiconductor package device and method of manufacturing the same | Chien Lin CHANG CHIEN, Chin-Li KAO, Shih-Yu Wang | 2018-11-20 |
| 10056325 | Semiconductor package having a trench penetrating a main body | Chin-Li KAO, Yi-Shao Lai | 2018-08-21 |
| 10037974 | Semiconductor device package and method of manufacturing the same | Chien Lin CHANG CHIEN, Chin-Li KAO, Dao-Long Chen, Ta-Chien Cheng | 2018-07-31 |
| 9917043 | Semiconductor package device and method of manufacturing the same | Chien Lin CHANG CHIEN, Chin-Li KAO, Chih-Pin Hung | 2018-03-13 |