Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115579 | Method for manufacturing wafer-level semiconductor packages | Teng Hock Kuah | 2018-10-30 |
| 10014187 | Cavity package with pre-molded substrate | — | 2018-07-03 |
| 9887149 | Cavity package with die attach pad | — | 2018-02-06 |