AY

Akira Yamauchi

BC Bondtech Co.: 1 patents #1 of 4Top 25%
KT Kabushiki Kaisha Toshiba: 1 patents #924 of 2,455Top 40%
LC Lan Technical Service Co.: 1 patents #1 of 4Top 25%
TC Taiyo Yuden Co.: 1 patents #46 of 128Top 40%
UN Unknown: 1 patents #373 of 3,359Top 15%
📍 Kyoto, MI: #6 of 10 inventorsTop 60%
Overall (2017): #173,428 of 506,227Top 35%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9692371 Current feedback output circuit Hiroyuki Tsurumi 2017-06-27
9601350 Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly Tadatomo Suga, Ryuichi Kondou, Yoshiie Matsumoto 2017-03-21