YK

Yi-Ying Kuo

XI Xintec: 1 patents #21 of 44Top 50%
Overall (2017): #189,439 of 506,227Top 40%
1
Patents 2017

Issued Patents 2017

Patent #TitleCo-InventorsDate
9799778 Chip package having a trench exposed protruding conductive pad Ming-Chieh Huang, Hsi-Chien Lin 2017-10-24