Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9706665 | Device for assembling a chip on a substrate by providing a solder-forming mass | Jean-Michel Morelle, Sandra Dimelli, Laurent Deneu-Fontaine, Romaric Lenoir | 2017-07-11 |