CW

Chun Hong Wo

UC United Test And Assembly Center: 1 patents #1 of 3Top 35%
📍 Singapore, SG: #372 of 1,548 inventorsTop 25%
Overall (2017): #457,839 of 506,227Top 95%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9786625 Semiconductor packages and methods of packaging semiconductor devices Yongbo Yang, Antonio Jr. Bambalan Dimaano 2017-10-10