SW

Shuidi Wang

TU Tsinghua University: 1 patents #136 of 363Top 40%
Overall (2017): #241,442 of 506,227Top 50%
1
Patents 2017

Issued Patents 2017

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9613925 Method for bonding semiconductor devices on sustrate and bonding structure formed using the same Jian Cai, Ziyu Liu, Qian Wang, Yang Hu, Yu-Hsien Chen 2017-04-04