Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9743523 | Printed circuit board package structure and manufacturing method thereof | Bo-Shiung Huang, Wei-Hsiung Yang, Cheng-Feng Lin | 2017-08-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9743523 | Printed circuit board package structure and manufacturing method thereof | Bo-Shiung Huang, Wei-Hsiung Yang, Cheng-Feng Lin | 2017-08-22 |