Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824954 | Semiconductor package comprising stacked integrated circuit chips having connection terminals and through electrodes symmetrically arranged | — | 2017-11-21 |
TK
Takayuki Kamiya
Overall (2017): #225,939 of 506,227Top 45%
1
Patents 2017