Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728426 | Method for producing resin-encapsulated electronic component, bump-formed plate-like member, resin-encapsulated electronic component, and method for producing bump-formed plate-like member | Hirokazu Okada, Hiroshi Uragami, Muneo Miura | 2017-08-08 |
| 9580827 | Method for producing electronic component, bump-formed plate-like member, electronic component, and method for producing bump-formed plate-like member | Hirokazu Okada, Hiroshi Uragami, Muneo Miura | 2017-02-28 |