Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9611138 | Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS) | Andrei A. Shkel | 2017-04-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9611138 | Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS) | Andrei A. Shkel | 2017-04-04 |