Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9564548 | Direct wafer bonding | Dhananjay M. Bhusari | 2017-02-07 |
| 9559237 | Optoelectric devices comprising hybrid metamorphic buffer layers | Xing-Quan Liu, Christopher M. Fetzer, Richard R. King | 2017-01-31 |