Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9718215 | Capacitive clamping process for cleaving work pieces using crack propagation | Andrew Bollman, Philip B. Van Stockum | 2017-08-01 |
| 9659764 | Method of controlled crack propagation for material cleavage using electromagnetic forces | Friedrich B. Prinz | 2017-05-23 |
| 9564286 | Method of forming thin film of semiconductor device | Sam Kim, Friedrich B. Prinz, Michael C. Langston, Peter Schindler, Ki Hyun Kim +2 more | 2017-02-07 |