Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9561952 | Hermetic-sealing package member, production method therefor, and hermetically-sealed package production method using this hermetic-sealing package member | Toshinori Ogashiwa, Yuya Sasaki | 2017-02-07 |
| 9539671 | Precious metal paste for bonding semiconductor element | Nobuyuki Akiyama, Katsuji Inagaki, Toshinori Ogashiwa | 2017-01-10 |